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Title:
SOLIDIFICATION CRACKING SUSCEPTIBILITY EVALUATION METHOD OF ALLOY, SOLIDIFICATION CRACKING SUSCEPTIBILITY EVALUATION DEVICE OF ALLOY, AND SOLIDIFICATION CRACKING SUSCEPTIBILITY EVALUATION PROGRAM OF ALLOY
Document Type and Number:
Japanese Patent JP2023141920
Kind Code:
A
Abstract:
To provide a solidification cracking susceptibility evaluation method of an alloy capable of accurately and uniformly evaluating the solidification cracking susceptibility of an alloy for various alloy systems.SOLUTION: A solidification cracking susceptibility evaluation method of an alloy for evaluating the solidification cracking susceptibility during casting of the alloy includes: a structure information acquisition step S01 for acquiring structure information at an arbitrary solid phase ratio for the alloy during solidification; a solid phase bonding ratio calculation step S02 for determining the solid phase bonding ratio calculated from the α phase, the compound phase, and the residual liquid phase by analyzing the acquired structure information and determining the solid phase bonding ratio calculated from the α phase-α phase interface length Lαα, the α phase-compound phase interface length Lαc, and the α phase-liquid phase interface length LαL by the solid phase bonding ratio=(Lαα+Lαc)/(Lαα+Lαc+LαL); and a solidification cracking susceptibility evaluation step S03 for evaluating the solidification cracking susceptibility of the alloy based on the calculated solid phase bonding ratio.SELECTED DRAWING: Figure 1

Inventors:
MATSUSHITA AKIRA
TANIGUCHI KENICHI
SAKAMOTO TOSHIO
YOSHIDA MAKOTO
NAGATA YOSHIHIRO
Application Number:
JP2022048502A
Publication Date:
October 05, 2023
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
UNIV WASEDA
International Classes:
B22D46/00; B22D21/00; B22D21/04
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori