Title:
SOLUTION FOR SEALING TREATMENT AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JPH04193982
Kind Code:
A
Abstract:
PURPOSE:To improve the lubricity and corrosion resistance of a metallic material and to reduce its contact resistance by treating a metallic material applied with plating of Ni, Pd and Au series by an organic solvent soln. essentially consisting of petrolatum and chelate formable cyclic nitrogen compounds. CONSTITUTION:An organic solvent soln. essentially consisting of, by weight, 0.1 to 3% petrolatum and 0.05 to 3% chelate formable cyclic nitrogen compounds is prepd. Or, in addition to the above, a soln. for sealing treatment, contg. 0.001 to 1% aminic or phenolic oxidation preventing agent is further prepd. By using the above soln. for sealing treatment, a copper series or ferrous metallic material obtd. by applying an Ni plated surface layer with Pd (alloy) plating and furthermore applied with Au (alloy) plating is subjected to treatment to seal pinholes.
Inventors:
FUKAMACHI KAZUHIKO
SHIROKABE YASUHIRO
SHIROKABE YASUHIRO
Application Number:
JP32319290A
Publication Date:
July 14, 1992
Filing Date:
November 28, 1990
Export Citation:
Assignee:
NIPPON MINING CO LTD
International Classes:
C25D5/48; C09D5/08; H01R13/03; H01R43/16; (IPC1-7): C09D5/08; C25D5/48; H01R13/03; H01R43/16
Attorney, Agent or Firm:
Hiroshi Namikawa