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Patent Searching and Data


Title:
溶媒系接着剤組成物
Document Type and Number:
Japanese Patent JP7149293
Kind Code:
B2
Abstract:
Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for preparing a solvent-based adhesive composition, the methods comprising providing a polyester-urethane resin, providing an epoxy-terminated polyester compound, mixing the polyester-urethane resin, epoxy-terminated polyester compound, and phosphoric acid to form a resin mixture, diluting the resin mixture in a solvent to form a diluted resin mixture having an application solid content from 25 to 55 weight percent, based on the total weight of the diluted resin mixture, and curing the diluted resin mixture with an aliphatic isocyanate curing agent at a mix ratio (parts by weight resin mixture before dilution:parts by weight aliphatic isocyanate curing agent) of from 100:1 to 100:12. Laminates prepared comprising the solvent-based adhesives and according to the disclosed methods are also disclosed.

Inventors:
Lee, Wen Wen
Zupan Chic, Joseph Jay.
Harris, William Jay.
Clark, Paul
Schmidt, sauce ten
Application Number:
JP2019567569A
Publication Date:
October 06, 2022
Filing Date:
April 24, 2018
Export Citation:
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Assignee:
Dow Global Technologies LLC
International Classes:
C09J175/06; B32B27/00; B32B27/36; B32B27/38; B32B27/40; C08G59/20; C09J11/04; C09J11/06; C09J163/00; C09J167/00; C09J171/02
Domestic Patent References:
JP2006160904A
JP2084482A
JP7238270A
JP2016538379A
Foreign References:
WO2016077355A1
WO1998044026A1
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Yasuhito Suzuki