Title:
SOLVENT-FREE ADHESIVE AND LAMINATE
Document Type and Number:
Japanese Patent JP2021098825
Kind Code:
A
Abstract:
To provide a solvent-free adhesive that suppresses a viscosity rise after being blended with a polyol component and a polyisocyanate component, providing a long pot life, and, when used for a packaging material, ensures excellent heat seal strength and laminate strength even when an article with strong acidity is contained, and a laminate prepared with the adhesive.SOLUTION: A solvent-free adhesive contains a polyol component, a polyisocyanate component comprising a reactant between a polyalkylene glycol including a polyalkylene glycol with a number average molecular weight of 1,000-3,200 and an aromatic diisocyanate, and a compound having an acid anhydride group.SELECTED DRAWING: None
Inventors:
NATSUMI TATSUAKI
USA YUKI
UCHIYAMA SUKEKIYO
SATO YOSHIHIRO
USA YUKI
UCHIYAMA SUKEKIYO
SATO YOSHIHIRO
Application Number:
JP2019232018A
Publication Date:
July 01, 2021
Filing Date:
December 23, 2019
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
International Classes:
C09J175/08; B32B7/12; B32B27/40; C09J133/04; C09J175/06
Domestic Patent References:
| JP2018165324A | 2018-10-25 | |||
| JPH05179222A | 1993-07-20 | |||
| JPH0346034B2 | 1991-07-12 | |||
| JPH08209101A | 1996-08-13 |
Foreign References:
| WO2014115521A1 | 2014-07-31 |