Title:
無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
Document Type and Number:
Japanese Patent JP4602151
Kind Code:
B2
Abstract:
A solvent-free resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following general formulas (1-1) and (1-2), wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group having an organosiloxane moiety, (b) a reactive diluent, and (c) a photo-polymerization initiator, characterized in that a film of said resin composition with a film thickness of 100 mum prepared on a quartz glass substrate shows a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm.
Inventors:
Yoshinori Yoneda
Michihiro Sugo
Michihiro Sugo
Application Number:
JP2005122570A
Publication Date:
December 22, 2010
Filing Date:
April 20, 2005
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F2/44; C03C17/30; C08F2/50; C08F287/00; C08L79/08; C09D183/10; C09J183/10
Domestic Patent References:
| JP2002332305A | ||||
| JP2001228609A | ||||
| JP2003140339A | ||||
| JP60001227A |
Attorney, Agent or Firm:
Mitsuo Matsui