Title:
SOLVENT-SOLUBLE POLYIMIDE RESIN
Document Type and Number:
Japanese Patent JP2023123935
Kind Code:
A
Abstract:
To provide a polyimide resin which is excellent in heat resistance and mechanical strength, has solvent solubility and a low swelling degree to an electrolyte, has a coefficient of thermal expansion of 15-30 ppm/°C, and has a high retention ratio of tensile strength after immersion of the electrolyte, and an adhesive containing the same, a laminate, and a member for a battery.SOLUTION: There are provided a solvent-soluble polyimide resin which has a repeating unit containing (a) a 3,3'-4,4'- biphenyltetracarboxylic acid dianhydride (s-BPDA), and (b) 2,2'-dimethyl-4,4-biphenyldiamine (m-TOLIDINE) and/or 4,4-diaminodiphenyl ether (p-DADE), and a repeating unit containing (c) a 4,4-oxydiphthalic acid dianhydride (ODPA) and (d) 2,5-dimethyl-1,4-phenylene diamine (DMPDA) in a main chain, and a method for producing the same.SELECTED DRAWING: None
Inventors:
SUZUKI TETSUAKI
TO CHO
REN XIANG
TO CHO
REN XIANG
Application Number:
JP2022027424A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
HEFEI HANNOWA NEW MATERIALS TECH CO LTD
International Classes:
C08G73/10; H01M4/66
Attorney, Agent or Firm:
Patent Attorney Corporation Tanikawa International Patent Office