Title:
SOLVENTLESS POLYIMIDE SILICONE RESIN COMPOSITION AND RESIN COATING FILM USING THE SAME
Document Type and Number:
Japanese Patent JP3865046
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a polyimide silicone resin composition substantially containing no solvent and, therefore, capable of eliminating a process of solvent removal and giving high adhesiveness to base materials of various shapes, using a (meth)acrylic compound which is a reactive compound with the polyimide silicone resin as a diluent.
SOLUTION: The solventless polyimide silicone resin composition comprises a polyimide silicone resin having a repeating unit represented by formula (1) (wherein X is a 4-valent organic group, Y is a bivalent organic group, Z is a bivalent organic group having an organosiloxane structure, and (p) and (q) are each independently a positive number), a (meth)acrylic compound, and a polymerization initiator, and has fluidity at 25°C and contains substantially no solvent.
Inventors:
Michihiro Sugo
Akira Yamamoto
Hideto Kato
Akira Yamamoto
Hideto Kato
Application Number:
JP2001137046A
Publication Date:
January 10, 2007
Filing Date:
May 08, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F2/44; C08F2/50; C08F287/00; C08G77/455; C08L79/08; C08L83/08; C09D4/02; C09D5/00; C09D179/08; C09D183/10; C09J4/02; C09J179/08; C09J183/10; H01B3/30; (IPC1-7): C08F2/44; C08F2/50; C08F287/00; C09D4/02; C09D5/00; C09D179/08; C09D183/10; C09J4/02; C09J179/08; C09J183/10
Domestic Patent References:
| JP6287523A | ||||
| JP5140525A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa