Title:
SOUND ABSORBER
Document Type and Number:
Japanese Patent JP2020064171
Kind Code:
A
Abstract:
To provide a sound absorber that has superior weatherability, does not require a large installation space, is lightweight, and can be fitted to even a narrow part of piping etc.SOLUTION: A sound absorber 1 has an embossment structure 2 formed substantially entirely on a surface of a laminate material 10, having a metal foil layer 11, a first resin layer 12 laminated on one surface of the metal foil layer, and a second resin layer 13 laminated on the other surface of the metal foil layer, with the side of the second resin layer convex. The embossment structure has a height difference of 0.1-5 mm. The sound absorber has the second resin layer arranged on a sound source side.SELECTED DRAWING: Figure 2
Inventors:
TATSUYA TADAMITSU
Application Number:
JP2018195672A
Publication Date:
April 23, 2020
Filing Date:
October 17, 2018
Export Citation:
Assignee:
SHOWA DENKO PACKAGING CO LTD
International Classes:
G10K11/16; B32B3/30; B32B15/08; E01F8/00; F01N1/24; G10K11/168
Attorney, Agent or Firm:
Matsumura Naoto
Akira Watanabe
Einosuke Kishimoto
Akira Watanabe
Einosuke Kishimoto