Title:
SOUND INSULATING FLOOR STRUCTURE
Document Type and Number:
Japanese Patent JP2002038622
Kind Code:
A
Abstract:
To provide a sound insulating floor structure particularly for reducing floor impact noise.
This sound insulating floor structure is provided with a sound absorbing material 13 forming a space A via a suspending member between a floor material 12 and a gypsum board 18 in the ceiling and arranged by contacting with the reverse of the floor material 12 and a sound insulating material 14 on the reverse of the sound absorbing material 13.
Inventors:
KUDO KAZUHIRO
TSURITA HIDETOSHI
TSURITA HIDETOSHI
Application Number:
JP2000221326A
Publication Date:
February 06, 2002
Filing Date:
July 21, 2000
Export Citation:
Assignee:
NICHIAS CORP
International Classes:
E04B1/86; E04F15/18; E04F15/20; (IPC1-7): E04B1/86; E04F15/18; E04F15/20
Attorney, Agent or Firm:
Kyoukan Iwata (1 person outside)