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Title:
SOUND INSULATION STRUCTURE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3188598
Kind Code:
B2
Abstract:

PURPOSE: To obtain excellent sound insulation performance and suitable cushion by providing a buffer material layer made of different hardness layers of a hard layer and a soft layer in a sound insulation structure, and forming the hard layer of entangled fiber assembly and the soft layer of freely entangled fiber.
CONSTITUTION: A sound insulation structure contains a buffer material layer made of at least two different hardness layers of a hard layer 3-a and a soft layer 3-b. The layer 3-a is formed of fiber assembly having form stability and high apparent density by entangled fiber bond. The layer 3-b is formed of fiber assembly having high compression elastic recovery rate and low apparent density with the free entangled fiber as a main body. The layer 3-b is disposed at the partition wall side. The buffer material layer for forming the structure has a carpet skin layer 1 in which a packing layer 2 is normally laminated on the upper (surface with thermoplastic resin as a main body when added to the floor the dwelling space of a house, a vehicle, a ship.


Inventors:
Yugoro Masuda
Hiroshi Onoe
Chihiro Ito
Hitoshi Ito
Hiroshi Sugawara
Application Number:
JP24629394A
Publication Date:
July 16, 2001
Filing Date:
October 12, 1994
Export Citation:
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Assignee:
Kanebo Co., Ltd.
Nissan Motor Co., Ltd
International Classes:
E04B1/86; B32B5/26; B60N3/04; G10K11/16; G10K11/162; (IPC1-7): B32B5/26; B60N3/04; G10K11/16; G10K11/162
Domestic Patent References:
JP8108810A
JP8104164A
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)



 
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