Title:
SOUND INSULATION WALL
Document Type and Number:
Japanese Patent JP3970553
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sound insulating board capable of reducing fear of scattering due to breakdown of a resin board, having durability against wind load.
SOLUTION: The sound insulating board is deformed and the concentration of external force to apart of the sound insulating board can be prevented because the sound insulating board has flexibility and is formed in a free-end structure in a frame body, large external force is not concentrated to a part of the sound insulating board as a periphery and a center when the sound insulating board is deflected by impulsive load as seen in a case when a peripheral section is formed in a fixed-end structure, and fear that forcible deformation is generated in the sound insulating board and the board is broken and scattered can be reduced.
Inventors:
Hisao Tanaka
Yoshio on the snow
Yoshio on the snow
Application Number:
JP2001139268A
Publication Date:
September 05, 2007
Filing Date:
May 09, 2001
Export Citation:
Assignee:
Sekisui Resin Co., Ltd.
International Classes:
E01F8/00; E01D19/10; E01F8/02; E01D101/00; (IPC1-7): E01F8/00; E01F8/02; //E01D19/10
Domestic Patent References:
| JP63171418U | ||||
| JP4061114U | ||||
| JP4302608A |