Title:
SPACE COOLING METHOD AND ITS DEVICE
Document Type and Number:
Japanese Patent JP2005061750
Kind Code:
A
Abstract:
To provide a cooling method and its device capable of easily cooling a surface-shaped or three-dimensional space, easy in molding a pipe, and wholly requiring no complicated constitution, by flowing and circulating a coolant, by connecting a cooling tower to the cooling pipe formed in a shape capable of covering a wall surface shape or a constant space.
The cooling pipe 1 allowing the coolant 2 to flow inside, is formed in a shape capable of covering the wall surface shape or a constant space. The cooling tower 3 is connected to this cooling pipe 1, to cool the periphery of the cooling pipe 1 by circulating and flowing the coolant 2 while cooling the coolant 2 flowing inside the cooling pipe 1.
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Inventors:
UCHINO MASAHIDE
Application Number:
JP2003294600A
Publication Date:
March 10, 2005
Filing Date:
August 18, 2003
Export Citation:
Assignee:
JAPAN FIELD KK
International Classes:
E04B1/74; B60H1/32; F25D9/00; F25D17/00; (IPC1-7): F25D17/00; B60H1/32; E04B1/74; F25D9/00
Attorney, Agent or Firm:
Osamu Shimizu