Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SPATTER APPARATUS
Document Type and Number:
Japanese Patent JPS55148770
Kind Code:
A
More Like This:
JPH0774437[Title of Invention] Thin film deposition apparatus
JPS57114663CYLINDRICAL MAGNETRON SPUTTERING CATHODE AND SPUTTERING APPARATUS EQUIPPED THEREWITH
JPS6483659SPUTTERING DEVICE FOR PRODUCING OXIDE SUPERCONDUCTIVE MATERIAL
Inventors:
MORRISON CHARLES F JUN
Application Number:
JP4614480A
Publication Date:
November 19, 1980
Filing Date:
April 08, 1980
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
VAC TEC SYST
International Classes:
C23C14/36; C23C14/35; H01J37/34; (IPC1-7): C23C15/00



 
Previous Patent: JPS55148769

Next Patent: CHEMICAL ETCHING METHOD OF WORKED ARTICLE SURFACE