Title:
速度センサアセンブリ
Document Type and Number:
Japanese Patent JP7091589
Kind Code:
B2
Abstract:
A speed sensor assembly (114) includes a printed circuit board (PCB) (120) having a first main side and a second main side, a magnet (116) directly coupled to the first main side of the PCB (120), a sensor (118) electrically connected to the PCB (120), and a pole piece (125) directly coupled to the magnet (116) and to the sensor (118), wherein the magnet (116) includes a slot partially enclosed by the pole piece (125). The speed sensor assembly (114) including a slotted magnet (116) to reduce magnetic field amplitude for single sensing element hall effect sensor applications. The speed sensor assemblies (114) operate with both minimum and maximum air gaps.
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Inventors:
Yu, Jao
Application Number:
JP2021513966A
Publication Date:
June 28, 2022
Filing Date:
September 19, 2018
Export Citation:
Assignee:
Hamlin Electronics (Sucho) Limited
International Classes:
G01P3/488; G01P3/487
Domestic Patent References:
| JP7101163B2 |
Foreign References:
| US4935698 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation