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Title:
SPINDLE MOVING MECHANISM FOR DICING EQUIPMENT
Document Type and Number:
Japanese Patent JP3294254
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a simple and compact spindle moving mechanism for a dicing equipment, wherein two spindles are rotated and two blades cut a wafer.
SOLUTION: This spindle moving mechanism is constituted mainly of guide rails 90, 92, which freely movable guide two carriages 72, 74 mounted with spindles 64, 66 in a Y-axis direction and a linear motor 76 which moves the carriages 72, 74 in the Y-axis direction. The linear motor 76 is constituted of a magnet rail 78 and two magnet blocks 80, 82. The magnet rail 78, the magnet block 80, and the magnet block 82 are fastened to a supporting plate 84, the carriage 72, and the carriage 74, respectively. When the linear motor is driven, the carriages 72, 74 move in the Y-axis direction along the common guide rails 90, 92.


Inventors:
Masateru Nagata
Masayuki Higashi
Hiroshi Shimoda
Felix Cohen
Application Number:
JP33053997A
Publication Date:
June 24, 2002
Filing Date:
December 01, 1997
Export Citation:
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Assignee:
Tokyo Seimitsu Co., Ltd.
Click and Sofa Investments Incorporated
International Classes:
H01L21/301; (IPC1-7): H01L21/301
Domestic Patent References:
JP825209A
JP4175549A
JP6201302A
JP4125043A
JP839542A
JP1126402A
JP460639U
JP311601B2
Attorney, Agent or Firm:
Kenzo Matsuura