Title:
タイクリップによって支持されたハニカムコアを備えるスプライス及びその形成方法
Document Type and Number:
Japanese Patent JP7074452
Kind Code:
B2
Abstract:
Provided are splices (200) comprising honeycomb cores (210,220) and adhesive layers (230) with tie clips (250) supporting the honeycomb cores (210,220). Also provided is a method of forming such splices. Each tie clip includes two legs (251,252) and a bridging portion joining the legs. When forming a splice, an adhesive layer (230) is positioned between two honeycomb cores (210,220). One leg of the tie clip (250) is inserted into the full cell of one honeycomb core, while the other leg is inserted into the full cell of the other honeycomb core. The bridging portion extends across the adhesive layer. While curing the adhesive layer, the tie clip (250) supports the honeycomb cores (210,220) with respect to each other and maintains their orientation. The tie clip (250) becomes a part of the splice (200). The tie clip may be buried in the honeycomb cores without extending above the first face of the splice.
Inventors:
Evan F Pierce
Mikel Dee Marty
Francis W Moore
Roger A Bown
Megan E Bliss
Mikel Dee Marty
Francis W Moore
Roger A Bown
Megan E Bliss
Application Number:
JP2017205883A
Publication Date:
May 24, 2022
Filing Date:
October 25, 2017
Export Citation:
Assignee:
The Boeing Company
International Classes:
B29C65/54; F16B5/06; F16B11/00
Domestic Patent References:
| JP2011519980A | ||||
| JP58143040U |
Foreign References:
| US6017413 |
Attorney, Agent or Firm:
Murayama Yasuhiko
Tatsuhiko Abe
Shinpei Kuroda
Choe Yun
Tatsuhiko Abe
Shinpei Kuroda
Choe Yun
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