Title:
SPLIT SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2005232580
Kind Code:
A
Abstract:
To provide a sputtering target of a large size which has low manufacturing cost and permits high-speed sputtering.
The large-sized sputtering target is produced by joining together a plurality of the targets by using metallic foil containing part or whole of component elements of the targets or cooling plates, or metallic foil of the material of which the dielectric constant, magnetic permeability, and thermal conductivity are the same as or similar to those of the targets or the cooling plates.
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Inventors:
KOJIMA MINORU
SAKAI KENJI
ARAI KAZUO
HASEGAWA TAMOTSU
SAKAI KENJI
ARAI KAZUO
HASEGAWA TAMOTSU
Application Number:
JP2004081455A
Publication Date:
September 02, 2005
Filing Date:
February 23, 2004
Export Citation:
Assignee:
TOYOSHIMA SEISAKUSHO KK
International Classes:
C23C14/34; (IPC1-7): C23C14/34
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