SPLITTING METHOD OF BRITTLE MATERIAL

Title:

SPLITTING METHOD OF BRITTLE MATERIAL

Document Type and Number:

Japanese Patent JP3210934

Kind Code:

B2

Abstract:

PURPOSE: To elevate a generating rate of initial crack at machining start point and to improve the machining speed and precision in executing splitting of brittle material with use of laser beam.
CONSTITUTION: Generation of an initial crack C is executed while simultaneously irradiating two positions P1, P2 at least near the edge of a work W with laser beam, successively, while plural irradiating positions S1, S2 are controlled to the prescribed position relationship or a laser output of irradiating positions S1, S2 is controlled, the laser beam is traveled along a splitting planned line L, crack C is induced. By this method, peculiar heat stress distribution is generated between laser beam irradiating positions, its tensile stress is made larger as compared to that of irradiation of one point laser beam, splitting control is improved by controlling the generating state of stress.

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Inventors:

Hideki Morita
Shunichi Maekawa
Toshihiro Okiyama
Hideyuki Shirahama
Toshiyuki Yokoyama
Hidenobu Onita

Application Number:

JP12614694A

Publication Date:

September 25, 2001

Filing Date:

June 08, 1994

Export Citation:

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Assignee:

Nagasaki Prefecture
Japan Science and Technology Agency

International Classes:

B23K26/40; B23K26/00; B23K26/064; B23K26/067; B23K26/38; H05K3/00; (IPC1-7): B23K26/00; B23K26/06

Domestic Patent References:

JP1108006A
JP54153745A

Attorney, Agent or Firm:

Yoshiro Kurauchi

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