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Title:
SPONTANEOUSLY DECOMPOSABLE RESIN COMPOSITION AND SPONTANEOUSLY DECOMPOSABLE MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2005226017
Kind Code:
A
Abstract:

To obtain an additive-type spontaneously decomposable resin composition and a spontaneously decomposable molded article having a decomposition rate adjustable with a safe component.

The spontaneously decomposable resin composition is composed of (A) 90-5 wt.% thermoplastic resin, (B) 0.01-1 wt.% coordination compound of a transition metal and (C) 10-95 wt.% wood flour. The composition is used as a molding material. The composition is preferably further compounded with an aromatic ketone, an unsaturated compound having double bond and a compatibilizing agent.


Inventors:
KAWANA YOSHIHIRO
FUJIKI TOMOKAZU
Application Number:
JP2004037519A
Publication Date:
August 25, 2005
Filing Date:
February 13, 2004
Export Citation:
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Assignee:
IRIS OHYAMA INC
International Classes:
C08L101/00; C08K5/07; C08K5/098; C08L21/00; C08L23/26; C08L97/02; C08L101/16; (IPC1-7): C08L101/00; C08K5/07; C08K5/098; C08L21/00; C08L23/26; C08L97/02
Attorney, Agent or Firm:
Hideo Tsukamoto