Title:
SPRAY TYPE ETCHING METHOD
Document Type and Number:
Japanese Patent JPS6462499
Kind Code:
A
Abstract:
PURPOSE:To increase an etching speed and to form a sure pattern with decreased side etching by incorporating an electric field applying means to a spray type etching means. CONSTITUTION:An object 1 to be etched which moves nearly horizontally on conveying rollers 2 is conducted to one electrode of a battery 8 via a brush 7 and an etching liquid 6 is poured from a spray nozzle 3 onto said object from above a hydrophilic counter electrode 9 which is connected to the other electrode of the battery 8 and is supported by a holder 5. The above-mentioned electrode 9 which is held without making contact with the object 1 to be etched is hydrophilic and, therefore, the liquid 6 builds up by the surface tension thereof to maintain the electrical contact of the electrode 8 with the liquid 6. The electric field etching effective within the limited range right under the electrode 9 is thus acted in addition to the ordinary spray etching. The object 1 to be etched is thereby etched exactly to the required pattern at the high etching speed.
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| JPH08258090 | METHOD AND APPARATUS FOR WASHING STAMPER |
Inventors:
OGAWA TETSUYA
SHINODA TSUTAE
TAKAHASHI TOICHI
SHINODA TSUTAE
TAKAHASHI TOICHI
Application Number:
JP21832787A
Publication Date:
March 08, 1989
Filing Date:
August 31, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C25F7/00; C25F3/02; (IPC1-7): C25F3/02; C25F7/00
Domestic Patent References:
| JPS5843479A | 1983-03-14 | |||
| JPS5843480A | 1983-03-14 | |||
| JPS60174899A | 1985-09-09 |
Attorney, Agent or Firm:
Sadaichi Igita