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Patent Searching and Data


Title:
SPRING-LOAD MEASURING APPARATUS
Document Type and Number:
Japanese Patent JPH10213495
Kind Code:
A
Abstract:

To make it possible to enhance measuring accuracy and to simultaneously measure the amount of the flexure of a spring and a change in a spring load due to the flexure by a method wherein a spring-load measuring device which is installed just above a measuring position is moved up and down with reference to an object, to be measured, installed at, and fixed, to a measuring base and its movement amount is displayed.

An object, to be measured, which comprises the flexure of a spring is installed at a measuring base 1, it is pressed by a pressure plate 3, and it is screwed by a screw 5 for mold clamping so as to be fixed. Then, a rotary handle 9 is turned, a push-pull gage 13 is moved downward together with an up-and-down movement part 11 until the tip part 21 of a measuring terminal 19 at the push-pull gage 13 hits a measuring position, and a pointer 23 at a dial gage 15 is aligned with 0 at a point of time when the tip part 21 of the measuring terminal 19 hits the measuring position at the object to be measured. From this state, the gate 13 is moved further downward by the handle 9, and the spring load of the object to be measured is measured. In addition, the tip part 17 of the gage 15 is moved downward so as to be interlocked with the gage 13, the pointer 23 is deflected so as to correspond to the amount of the flexure of the spring, and the amount of the flexure is displayed.


Inventors:
SUZUKI TAKAAKI
Application Number:
JP1698697A
Publication Date:
August 11, 1998
Filing Date:
January 30, 1997
Export Citation:
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Assignee:
TOSHIBA ELETRONIC IWATE
TOSHIBA CORP
International Classes:
G01L1/04; G01B5/02; G01L5/00; (IPC1-7): G01L1/04; G01B5/02; G01L5/00
Attorney, Agent or Firm:
Hidekazu Miyoshi (3 outside)