Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JPH05148634
Kind Code:
A
Abstract:

PURPOSE: To control the concn. of reactive gas on the central part and circumferential part of plasma at the time of introducing Ar and reactive gas in reactive sputtering.

CONSTITUTION: In the process of sputtering, reactive gas is introduced through gas piping 3, and Ar or reactive gas is independently introduced from a ring- shaped gas piping 4, by which the concn. control of the reactive gas in the diameter direction of a target 2 is executed to uniformize the reaction between the reactive gas and the target 2 in the face of the target.


Inventors:
TAKEHARA HIROSHI
Application Number:
JP33437591A
Publication Date:
June 15, 1993
Filing Date:
November 22, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORP
International Classes:
C23C14/34; C23C14/00; C23C14/54; H01L21/203; (IPC1-7): C23C14/34; C23C14/54; H01L21/203
Attorney, Agent or Firm:
Sugano Naka



 
Previous Patent: JPS5148633

Next Patent: JPS5148635