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Title:
SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JPS63137165
Kind Code:
A
Abstract:

PURPOSE: To enhance the utilization efficiency of a target and to make the thickness distribution of a film uniform, by circularly arranging plural pairs of magnetic poles on the rear side of the target so that the distribution of magnetic fields on the target is made uniform.

CONSTITUTION: Plural pairs of magnetic poles 6a, 6b are circularly arranged on the rear side of a target 5 and a magnetic field is formed from the center of the target 5 in the radial directions. Accordingly, magnetic fields are formed not only in the circumferential direction of the target 5 but also in directions perpendicular to the radial directions, so the distribution of magnetic fields on the target 5 is made uniform, local consumption of the target 5 is prevented and the utilization efficiency of the target 5 is enhanced. Particles generated by sputtering deposit uniformly on a substrate and a thin film having a uniform thickness distribution is obtd.


Inventors:
KAJIKAWA NOBUHIRO
Application Number:
JP28262086A
Publication Date:
June 09, 1988
Filing Date:
November 27, 1986
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/31; C23C14/34; C23C14/35; (IPC1-7): C23C14/34; H01L21/31
Domestic Patent References:
JPS61183471A1986-08-16
JP57154788B
JPS63109163A1988-05-13
JPS6353201A1988-03-07
Attorney, Agent or Firm:
Suyama Saichi



 
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