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Patent Searching and Data


Title:
SPUTTERING DEVICE AND SPUTTERING METHOD
Document Type and Number:
Japanese Patent JPH07126846
Kind Code:
A
Abstract:

PURPOSE: To improve the productivity of thin films by improving the efficiency of utilizing a sputtering target.

CONSTITUTION: The sputtering target 2 is provided with a radial current route 11 consisting of a radial conductor part 14 connecting a central electrode 12 and a peripheral edge electrode 13 behind the target without using a permanent magnet and a current is passed to this route, by which a uniform magnetic field distribution having only the components parallel with the target of the circumferential direction generated on the target surface is formed. At this time, the density distribution of the plasma near the target surface is made uniform and the region of erosion spreads to the entire part of the target without being limited to a part. As a result, the effective utilization of the sputtering target is possible and further, the frequency of exchanging the target is lowered. The productivity is thus improved.


Inventors:
SHIOKAWA AKIRA
YASUI HIDEAKI
KODERA KOICHI
Application Number:
JP27276893A
Publication Date:
May 16, 1995
Filing Date:
October 29, 1993
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C14/35; (IPC1-7): C23C14/35
Attorney, Agent or Firm:
Taketoshi Mototoshi