Title:
SPUTTERING DEVICE AND REVERSE SPUTTERING METHOD
Document Type and Number:
Japanese Patent JP3492076
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering device which has improved the adsorption property of the inwall of a reaction chamber for reverse sputtering processing, and a reverse sputtering method using the sputtering device.
SOLUTION: A reaction chamber 1 where the inwall face 1a is covered with a molten aluminum coated film 2, with the purity of not lower than 99.7% is prepared, and prior to the start of the reverse sputtering processing of a board 5, a dummy board 7 is set in the reaction chamber 1, and reverse sputtering processing is performed to separate the out gas adsorbed on the surface of the molten aluminum coated film 2, and then the board 5 is set in the reaction chamber 1, and reverse sputtering processing is performed while adsorbing the substance 10 flying from the board 5 favorably by the flame- coated film 2.
Inventors:
Motonori Oguni
Application Number:
JP10638096A
Publication Date:
February 03, 2004
Filing Date:
April 03, 1996
Export Citation:
Assignee:
株式会社リコー
International Classes:
C23C14/00; C23F4/00; H01L21/203; H01L21/285; (IPC1-7): H01L21/285; C23C14/00
Domestic Patent References:
| JP881771A | ||||
| JP7102366A | ||||
| JP867983A |
Attorney, Agent or Firm:
Shigeo Noguchi