Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JP2015025171
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress a decrease in film deposition speed due to sticking of sputter particles on a protection member.SOLUTION: A sputtering device includes: a chamber which is evacuated to product a vacuum; a plasma generating gas introduction part; a target holding part; a substrate holding part which holds a substrate as an object of film deposition opposite a target held by the target holding part; a plasma generation part which generates high-frequency induction coupling plasma of plasma generating gas in the chamber; a power source which applies a sputter voltage to the target; a dielectric-made protection member which protects the plasma generation part against exposure of the plasma generation part to the plasma generated in the chamber; and one or more sticking suppression members which are put over the protection member in a removable manner so as to cover a main surface, protruding into the chamber, of the protection member respectively, and suppress sputter particles sputtered from the garget from sticking on the protection member. A film is deposited on the substrate by sputtering the target.
Inventors:
OZAKI KAZUTO
NAKAJIMA NAOTO
NAKAJIMA NAOTO
Application Number:
JP2013155445A
Publication Date:
February 05, 2015
Filing Date:
July 26, 2013
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
C23C14/34; H05H1/46
Domestic Patent References:
| JPH1055983A | 1998-02-24 | |||
| JPH1116895A | 1999-01-22 | |||
| JPH02141575A | 1990-05-30 |
Foreign References:
| WO2013030954A1 | 2013-03-07 |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita
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