PURPOSE: To uniformize thin films formed on works and to control film thickness by providing the prescribed shutter plates between a work-holding means and a target-holding means and making the flying region of sputter grains adjustable.

CONSTITUTION: This sputtering device is constituted of a work-holding means 12, a target-holding means 16, two shutter plates 21, and a means 20 for controlling the amount of the sputter grains flying from a target 15 to the above holding means 12 side. The above holding means 12 is rotated on a central axis 18 of rotation without rotating works 11. Further, the above shutter plates 21 have end faces formed along the radial direction with respect to the above central axis 18, respectively, and these end faces 21a are made to face each other.