PURPOSE: To remarkability decrease foreign matter in films so as to improve film quality and product yield by making a side sputtering or sputtering up system possible.
CONSTITUTION: A substrate plate 4b is moved to a position where this place faces a target 16 from a horizontal position by a substrate electrode driving mechanism 13. Setting and taking out of the substrate 4a are executable in a horizontal state; in addition, the substrate is positioned to nearly a perpendicular state at the time of film formation and, therefore, the intrusion of the foreign matter into the film at the time of film formation is remarkability lessened. Further, the target 16 is freely changeable in the distance from the substrate 4a by parallel movement and the establishment of process conditions is easily executed.
SETOYAMA HIDETSUGU
UMEHARA SATOSHI
