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Patent Searching and Data


Title:
SPUTTERING TARGET AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH07180045
Kind Code:
A
Abstract:

PURPOSE: To provide a sputtering target for thin film deposition for DC magnetron sputtering by incorporating a specific amount of yittrium.

CONSTITUTION: After dissolving an organic binder (e.g. polyphenylene, phenol) in a solvent, a slurry is prepared by admixing yittria powders thereto. Allowing the solvent to evaporate from the slurry, a thin coating of organic binder is left on the particles of yittria powders. Unprocessed articles in a specified shape are produced by drying and compressing, and are subjected to heating thereby decomposing the organic binder. By heating the unprocessed articles under a non-oxidizing atmosphere for converting the thermally decomposed organic binder into amorphous carbon, the electroconductive sputtering target is produced. It is so arranged that 35 vol.% of yittria in respect to the total volume of the target is contained.


Inventors:
KIYASURIIN MARII HANPARU
JIEEMUZU PATORITSUKU MAZAAZU
MAIKERU BERII HINTSU
Application Number:
JP22764494A
Publication Date:
July 18, 1995
Filing Date:
September 22, 1994
Export Citation:
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Assignee:
MINNESOTA MINING & MFG
International Classes:
C04B35/01; C04B35/505; C23C14/08; C23C14/34; G11B7/26; (IPC1-7): C23C14/34; C23C14/08; G11B7/26
Attorney, Agent or Firm:
Takashi Ishida (3 others)