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Title:
スパッタリングターゲット及びスパッタリングターゲットの製造方法
Document Type and Number:
Japanese Patent JP7072664
Kind Code:
B2
Abstract:
The present invention provides a sputtering target which contains Ru and boron. A sputtering target which contains Ru as a main component, while containing a composite oxide that contains boron and has a higher melting point than B2O3.

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Inventors:
Yasuyuki Iwabuchi
Atsushi Sato
Boarding house Akira
Shimizu Masayoshi
Application Number:
JP2020547948A
Publication Date:
May 20, 2022
Filing Date:
May 16, 2019
Export Citation:
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Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C23C14/34; B22F1/12; C22C1/05; C22C32/00
Domestic Patent References:
JP2006283054A
JP2008101246A
JP2015155573A
JP2010514921A
Foreign References:
WO2014178310A1
WO2016035415A1
WO2016013334A1
WO2018123500A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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