Title:
SQUEEGEE AND MANUFACTURING METHOD OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023012717
Kind Code:
A
Abstract:
To provide a squeegee which can inhibit a supply amount of a solder paste from being unstable and prevent damage of the squeegee, and to provide a manufacturing method of a circuit board.SOLUTION: A squeegee 100 includes a support plate part 3 and a blade part 1. The blade part 1 includes an overlapping part 11 and a protruding part 12. The support plate part 3 and the blade part 1 include a first part 21 and a second part 22. The first part 21 has a first end E1 as seen in a protruding direction DR1 in which the protruding part 12 protrudes from the overlapping part 11. The second part 22 has a second end E2 as seen in the protruding direction DR1. The first end E1 and the second end E2 are continuously formed into a straight line. The support plate part 3 and the blade part 1 are formed so that rigidity of the first part 21 at the first end E1 becomes lower than rigidity of the second part 22 at the second end E2.SELECTED DRAWING: Figure 1
Inventors:
SASAKI SHUNSUKE
TANABE TAKESHI
TANABE TAKESHI
Application Number:
JP2021116337A
Publication Date:
January 26, 2023
Filing Date:
July 14, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/12; B41F15/08; B41F15/44; H05K3/34
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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