Title:
STACKABLE MOLDED ULTRA SMALL ELECTRONIC PACKAGE INCLUDING AREA ARRAY UNIT CONNECTOR
Document Type and Number:
Japanese Patent JP2017038075
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a stackable molded ultra small electronic package in which a package contact can be provided on the upper or lower surface of an ultra mall electronic element.SOLUTION: An ultra small electronic package 290 including a substrate 230, an ultra small electronic element 170, and a terminal 240 further includes conductive elements 238 for electrically connecting the contacts of a chip and the contacts of the substrate. The conductive elements can be electrically insulated from each other so as to convey different potentials simultaneously. An encapsulating material overlaps the first surface of the substrate, and at least a part of the surface of the ultra small electronic element remote from the substrate, and has a principal surface above the ultra small electronic element. A plurality of package contacts 220 overlap the surface of the ultra small electronic element remote from the substrate.SELECTED DRAWING: Figure 13
Inventors:
BELGACEM HABA
Application Number:
JP2016202866A
Publication Date:
February 16, 2017
Filing Date:
October 14, 2016
Export Citation:
Assignee:
TESSERA INC
International Classes:
H01L23/12; H01L21/50; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2008034534A | 2008-02-14 | |||
| JP2009506553A | 2009-02-12 | |||
| JP2006344917A | 2006-12-21 |
Foreign References:
| US20100032822A1 | 2010-02-11 | |||
| US20060278970A1 | 2006-12-14 |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi