Title:
STAGE MOVEMENT IN WAFER PROBING APPARATUS
Document Type and Number:
Japanese Patent JP3152737
Kind Code:
B2
Abstract:
PURPOSE: To provide a stage moving method for reducing a measuring period of a sheet of wafer to realize highly efficient probing test through simultaneous measurement.
CONSTITUTION: In a wafer probing apparatus for realizing simultaneous measuring test for four chips while moving a stage on which a wafer is set in both X and Y directions, the probing start position is determined (step S11) based on preset chip size, the number of wafers to be measured simultaneously and directions (X/Y) and each preset data of a probing area and probing is conducted in unit of four chips in the column direction (X axis direction) of each row (Y axis) in the chip arrangement of wafer (steps S12 to S14). At the time of movement of the probe to the next row, the optimum probing start position of the next row is obtained (step S16) based on each preset data and the probe is moved to such position (step S17).
Inventors:
Shinobu Watanabe
Application Number:
JP12265292A
Publication Date:
April 03, 2001
Filing Date:
April 16, 1992
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
G01R31/28; H01L21/66; G12B5/00; H01L21/68; (IPC1-7): H01L21/66; G01R31/28
Domestic Patent References:
| JP5486283A | ||||
| JP59185835U |
Attorney, Agent or Firm:
Kuninori Funabashi