To provide a stainless steel or the like whose corrosion resistance to lead-free solder is improved.
The stainless steel 10 has corrosion resistance to lead-free solder, and comprises: a nitriding reformed layer 12 formed on the surface of an austenitic stainless steel body 11, further comprising no chromium nitride and comprising nitrogen and chromium as solid solutions; and a passive film 13 formed on the surface of the nitriding reformed layer 12 with nitric acid. The passive film 13 is made of chromium oxide. The passive film 13 has excellent corrosion resistance, thus functions as a protective film to lead-free solder. The thickness of the nitriding reformed layer 12 is, e.g., 5 to 15 μm. The thickness of the passive film 13 is, e.g., ≥10 nm.
IIJIMA MASAKI
YOSHIDA SHUNICHI
TAMURA FA SYSTEM CO LTD
JPS61195988A | 1986-08-30 | |||
JP2001335957A | 2001-12-07 | |||
JP2001214256A | 2001-08-07 |
WO2005093115A1 | 2005-10-06 |