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Patent Searching and Data


Title:
STAMP FORMING MATERIAL PACKAGED BODY
Document Type and Number:
Japanese Patent JPH03275471
Kind Code:
A
Abstract:

PURPOSE: To prevent a stamp forming material from absorbing moisture, and prevent hydrolizing due to water content at the time of heating of a thermoplastic resin from happening by a method wherein a stamp forming material of which periphery is covered by a protective film is vacuum-packaged in a packaging bag which is made of a moistureproof film with a specific steam permeation constant.

CONSTITUTION: A stamp forming material of which periphery is covered by a protective film is vacuum-packaged in a packaging bag which is made of a moistureproof film of which steam permeation constant is 0.1g.20μ/m2.day/atm or lower for the title packaged body. For the protective film, normally a flexible film with a thickness of 20μ or higher and fracture ductility of 10% or higher, e.g. a film made of vinyl chloride with a thickness of 100-200μ is suitable. For the moistureproof film, e.g. a film for which on a biaxial orientation film such as polyethylene or vinyl chloride or nonorientation film, aluminum foil is laminated is suitable. By using the stamp forming material packaged body, water content of a stamp forming material can be kept at 500ppm or lower for a long period of time, and forms which are obtained by stamp forming this type of stamp forming material do not receive heat deterioration and have an excellent mechanical performance.


Inventors:
ISHII TOSHINORI
FUJII KIYONOBU
HORI NAONOBU
YAMANA YOSHIHIRO
ONISHI ISAO
Application Number:
JP7499990A
Publication Date:
December 06, 1991
Filing Date:
March 22, 1990
Export Citation:
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Assignee:
KURARAY CO
International Classes:
B65D81/20; B65D81/24; (IPC1-7): B65D81/20; B65D81/24