Title:
STAMP KIT
Document Type and Number:
Japanese Patent JP2005066944
Kind Code:
A
Abstract:
To provide a stamp kit for assembling a stamp which can freely lay out a design content such as a character or pattern.
This stamp kit is composed of a marking sheet 11 with a marking face 11 including one or more than one design contents A to D formed thereon and a double-side adhesive film 13 attached to the back of the marking sheet 11. In addition, a stamping face element 1 with a cutoff line 14 formed along the borderlines of the design contents A to D and a plate-like body 2 to which the stamping face parts 11A to 11D cut off the stamping face element 1 are attached through the double-side adhesive film 13, are provided.
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Inventors:
MATSUSHITA IKUZO
TAGUCHI TAKASHI
TAGUCHI TAKASHI
Application Number:
JP2003297519A
Publication Date:
March 17, 2005
Filing Date:
August 21, 2003
Export Citation:
Assignee:
TAGLAND KK
International Classes:
B41K1/04; B43M99/00; (IPC1-7): B41K1/04; B43M17/00
Attorney, Agent or Firm:
Shingo Nishide
Hitoshi Maeda
Koichiro Okura
Miki Sato
Hitoshi Maeda
Koichiro Okura
Miki Sato