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Patent Searching and Data


Title:
STAMP WATER ATTACHMENT IMPLEMENT
Document Type and Number:
Japanese Patent JP2004175087
Kind Code:
A
Abstract:

To provide a stamp water attachment implement capable of solving the problem in the conventional stamp water attachment implement using a sponge as a water absorber that water attached to stamps overflows if there is too much water in a water container, while water must be absorbed so frequently if there is little water in the container.

In the implement, the water absorber is put inside the recessed water container opening upward, a pair of slender slots are provided on two places of the bottom plate supporting base of the absorber, a water refilling bar connected between water absorbing part and non-absorbing part is run through the slots and installed by sandwiching the bottom plate so as to vertically be annular with the bottom of the water absorbing part touched under the bottom plate and the top touched the absorber, and then the length touching the absorber is categorized into three stages of large, medium and small. Thus the volume of water in the water absorber can be adjusted to solve the problem regarding the stamp water attachment implement.


Inventors:
SHINODA SHIGERU
Application Number:
JP2002382659A
Publication Date:
June 24, 2004
Filing Date:
November 25, 2002
Export Citation:
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Assignee:
SHINODA SHIGERU
International Classes:
B43M11/00; (IPC1-7): B43M11/00