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Patent Searching and Data


Title:
STAMPING METHOD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2001239795
Kind Code:
A
Abstract:

To restrain the abrasion of a pen point even when the hardness of a work is the same degree as that of the pen point.

Upon stamping, the working site on the working surface of the work and the working site is irradiated with laser beams 7 from a working site softening mechanism 6 and softened whereby the condition of the pen point 2 becomes same as a case wherein the pen point 2 is stamped against the work having a low hardness and the abrasion of the pen point 2 can be restrained surely. Accordingly, the abrasion of the pen point 2 can be mitigated and the early abrasion of the same can be restrained surely even when the hardness of the pen point 2 is the same degree as that of the work 1 whereby the life of the pen point 2 can be elongated, thereby permitting the improvement of durability as well as reliability of the device to that extent.


Inventors:
TANAKA YASUHIRO
MIYAKI SHIYOUSUKE
YANO TETSUO
Application Number:
JP2000052562A
Publication Date:
September 04, 2001
Filing Date:
February 28, 2000
Export Citation:
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Assignee:
ANDO ELECTRIC
International Classes:
B44B3/00; B44B5/00; (IPC1-7): B44B3/00
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)