Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
STICKING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2008182016
Kind Code:
A
Abstract:

To provide a sticking apparatus, or the like, for sticking in parallel a couple of sheets of thin and flat processing objects.

The sticking apparatus includes an attracting mechanism for controlling a first holding member 11 and a second holding member 12 to attract and hold a first processing object W and a second processing object S, in a state of being opposed with each other in the longitudinal direction, a heating mechanism for heating and fusing a thermally fusible bonding agent provided between the first processing object W and the second processing object S, and a moving mechanism for moving, in the upper and lower directions, at least one of the first holding member 11 and the second holding member 12. A plurality of attracting portions 110 are provided to attract the first processing object W, at a first holding surface 11a of the first holding member 11, and the attracting mechanism individually adjusts the attracting forces of the plurality of attracting portions 110 to attract the first processing object W, in order to separate a part of the first processing object W from the first holding surface 11a, at the solidifying of the bonding agent fused with heat treatment.


Inventors:
OKASE WATARU
TAKANABE EIICHIRO
Application Number:
JP2007013644A
Publication Date:
August 07, 2008
Filing Date:
January 24, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/02; H01L21/683
Attorney, Agent or Firm:
Hidekazu Tanikawa