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Title:
STRAIN MEASUREMENT METHOD AND STRAIN MEASURING APPARATUS
Document Type and Number:
Japanese Patent JP2008039530
Kind Code:
A
Abstract:

To provide a strain measurement method and a strain measuring apparatus, capable of not only measuring the strain generated in a minute region of a specimen, but also measuring both the strain in the planar direction of the surface of the specimen and the stain in the thickness direction of the specimen.

The strain measurement method and the stain measuring apparatus for measuring the stain generated in the specimen by using a polygonal pyramid-shaped dimple formed on the specimen comprise a dimple-shape measuring means which measures respective shapes of the dimple before and after the stain arises in the specimen; and an arithmetic means which calculates the strain from the amount of the shape change in the dimple measured by the dimple-shape measuring means. The dimple-shape measuring means measures the position of a vertex of the polygonal pyramid faces of the polygonal pyramid-shaped dimple, and the arithmetic means calculates the stain from the amount of change in the position of the vertex.


Inventors:
UCHIDA MAKOTO
TADA NAOYA
SHIMIZU ICHIRO
Application Number:
JP2006212662A
Publication Date:
February 21, 2008
Filing Date:
August 03, 2006
Export Citation:
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Assignee:
UNIV OKAYAMA
International Classes:
G01B21/32
Domestic Patent References:
JPS51140656A1976-12-03
JPH0518899A1993-01-26
JPS63241405A1988-10-06
JPH06235618A1994-08-23
JP2003207432A2003-07-25
Attorney, Agent or Firm:
Kenichiro Matsuo