Title:
構造用接着フィルム
Document Type and Number:
Japanese Patent JP6800188
Kind Code:
B2
Abstract:
This invention relates to a structural adhesive film suitable for bonding metal parts, and in particular for hem flange bonding of metal parts. More specifically, the present invention is directed to a structural adhesive film comprising a thermosettable composition which comprises an epoxy compound having a selected average epoxy equivalent weight, a thermoplastic resin having a selected softening point, and an epoxy curing agent. The present invention further relates to a thermoset structural adhesive film obtainable by thermosetting of the structural adhesive film of then invention, and to a metal part assembly comprising such a thermoset structural adhesive film. In another aspect, the present invention is directed to a method for bonding metal parts, in particular for hem flange bonding of metal parts.
Inventors:
Erguimavi, Sohive
Cooler, elizabeth
Koch, Bernhard H.
Yahus, nuretin
Cooler, elizabeth
Koch, Bernhard H.
Yahus, nuretin
Application Number:
JP2018166385A
Publication Date:
December 16, 2020
Filing Date:
September 05, 2018
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J7/35; C09J5/04; C09J7/10; C09J163/00; C09J171/08; C09J201/00
Domestic Patent References:
| JP10178054A | ||||
| JP2011505478A | ||||
| JP62086083A |
Foreign References:
| US20120121878 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki