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Patent Searching and Data


Title:
STRUCTURE FOR FIXING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2002280765
Kind Code:
A
Abstract:

To realize a structure for fixing an electronic component, in which an acoustic component, e.g. a speaker, or other electronic component can be fixed easily to a housing.

A printed board 13 is disposed in the inner space 12 of the body of portable telephone surrounded by an upper housing 11A and a lower housing 11B. The speaker body 14 is secured to the upper surface of the printed board 13 by soldering the terminals 15A and 15B. A cap 52 secured with a net 51 is fitted over the head part of the speaker body 14. A rib 52A having triangular cross-section formed at the upper part of the cap 52 is pressed against the upper housing 11A. Consequently, moisture and dust intruding from a sound hole 17 can be interrupted without requiring any adhesive or both-sided tape. Interruption of moisture and dust utilizing deformation of a resilient member is also applicable to electronic components other than acoustic components.


Inventors:
KURODA MITSURU
Application Number:
JP2001081270A
Publication Date:
September 27, 2002
Filing Date:
March 21, 2001
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K7/12; H04M1/02; H04M1/03; (IPC1-7): H05K7/12; H04M1/02; H04M1/03
Attorney, Agent or Firm:
Umeo Yamauchi