Title:
硬化層と金属配線を有する構造物の形成方法及び構造物形成装置
Document Type and Number:
Japanese Patent JP7197489
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a semi-cured layer forming method and a semi-cured layer forming device with which it is possible to further flatten a target surface of a semi-cured layer. The method for forming a structure according to the present disclosure comprises: a first ejection step of ejecting a curable viscous fluid; a first semi-curing step of semi-curing the curable viscous fluid ejected in the first ejection step; a first semi-cured layer forming step of repeatedly performing the first ejection step and the first semi-curing step to form a first semi-cured layer; a flattening step of flattening at least a part of the first semi-cured layer with a flattening device to form a target surface in the first semi-cured layer; a second ejection step of ejecting the curable viscous fluid onto the target surface; a second semi-curing step of semi-curing the curable viscous fluid ejected in the second ejection step; and a second semi-cured layer forming step of repeatedly performing the second ejection step and the second semi-curing step to form a second semi-cured layer thinner than the first semi-cured layer.
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Inventors:
Ryosuke Hashimoto
Katsuaki Makihara
Katsuaki Makihara
Application Number:
JP2019542918A
Publication Date:
December 27, 2022
Filing Date:
September 22, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
B29C64/106; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
| JP201367118A | ||||
| JP2015150708A | ||||
| JP2015231684A |
Foreign References:
| WO2015041189A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Next