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Patent Searching and Data


Title:
STRUCTURE AND METHOD OF PLACING COMPONENT ONTO EQUIPMENT
Document Type and Number:
Japanese Patent JPH036091
Kind Code:
A
Abstract:

PURPOSE: To improve mounting efficiency of a printed board by mounting a leadless chip component on a flexible printed board, coupling and connecting components to each other with elastic conductive resin.

CONSTITUTION: Leadless chip components 3, 3' are mounted on a flexible printed board 2, and coupled and connected to each other with elastic conductive resin 5. Thus, when the components 3, 3' are connected with the resin having elasticity, the connected parts of the components 3, 3' can be bent. Accordingly, even after the components 3, 3' are placed, the board 2 can be disposed along the round profile of an equipment 1. The components can be mounted on the bent part of the board. Thus, the mounting efficiency of the board can be improved.


Inventors:
YOSHII MASAYUKI
OKU SHUNJI
KOUWA MIKA
MIZUMO YOSHIYUKI
Application Number:
JP14145689A
Publication Date:
January 11, 1991
Filing Date:
June 02, 1989
Export Citation:
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Assignee:
MINOLTA CAMERA KK
International Classes:
H05K3/32; H05K1/18; H05K7/14; H05K1/00; H05K3/34; (IPC1-7): H05K1/18; H05K3/32; H05K7/14
Attorney, Agent or Firm:
Kosuke Agata