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Patent Searching and Data


Title:
STRUCTURE OF MOUNTING HEAT SLINGER
Document Type and Number:
Japanese Patent JPH10112592
Kind Code:
A
Abstract:

To allow it to strongly mount a heat slinger and a printed wiring board without using a screw and a tool by means of a simple work.

Side plates 1b, 1c of a heat slinger 1 are provided with mounting feet 2, 4 provided with engaging parts 3, 5, these engaging parts 3, 5 are formed by pushing out the side plate 1b and the mounting foot 2 as well as the side plate 1b, 1c and the mounting feet 2, 4 are provided with engaging parts 3, 5, these engaging parts 3, 5 are formed by pushing out the side plate 1b and the mounting foot 2 as well as the side plate 1c and the mounting foot 4 from one side main face to the other side main faice, further one side each of the tip side sides of the mounting feet of these engaging parts 3, 5 is cut and shaped. Further, a printed board 6 is provided with mounting holes 7, 8 so as to form projection parts 7a, 7b in the insides and in the state in which these mounting feet 2, 4 are inserted into these mounting holes 7, 8 and stepped projection parts 7a, 8a of the mounting holes 7, 8 are pressed and fitted against the engaging parts 3, 5 of the mounting feet 2, 4. Thereby, the heat slinger is fixed to the printed board 6.


Inventors:
TAKAHASHI TAKESHI
Application Number:
JP26461496A
Publication Date:
April 28, 1998
Filing Date:
October 04, 1996
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K7/20; (IPC1-7): H05K7/20