PURPOSE: To concurrently bond many studs and form electricity receiving faces parallel with the principal plane of a board by pressing heater chips to the electricity receiving faces of the studs with multiple pressing means held vertically to a table.

CONSTITUTION: Air cylinders 13-2 are held vertically to a table 13-3 by a holding metal 13-4 at positions facing respective studs 2 inserted into a printed circuit board 1, tip faces of heater chips 13-1 are faced to the electricity receiving faces 2-2 provided on the end faces of the studs 2 of the printed circuit board 1 mounted on the table 13-3. An air cylinder 13-2 is driven to press the heater chips 13-1 with the solder melting temperature to the electricity receiving faces 2-2, solder is melted, the electricity receiving faces 2-2 are made parallel with the principal plane of the printed circuit board 1, and many studs 2 can be bonded to the printed circuit board 1 at once.