STYRENIC RESIN COMPOSITION AND MOLDED BODY, CARRIER TAPE FOR CONVEYING ELECTRONIC COMPONENT EACH USING THE SAME

Japanese Patent JP2023138475

A

To provide a styrenic resin composition which maintains a certain level of transparency, and furthermore is suppressed in/prevented from thinning when molded, and is excellent in deep draw moldability when molded, and a molded body using the same and a carrier tape for conveying an electronic component.SOLUTION: A styrenic resin composition is provided, containing rubbery polymer particles containing a rubbery polymer, and a styrenic polymer constituting a polymer matrix phase, wherein the styrenic polymer has a styrenic monomer unit (a1), 7-50 mass% of a (meth)acrylate monomer unit (a2), and 0.001-20 mass% of a (meth)acrylate monomer unit (a3) having a molecular weight larger than that of the (meth)acrylate monomer unit (a2), the refractive index of the polymer matrix phase is 1.538 to 1.575, an absolute value of a difference in the refractive index between the polymer matrix phase and the rubbery polymer particles is within a range of 0-0.015, the number average molecular weight (Mn) of the styrenic polymer is 40,000 to 120,000, the weight average molecular weight (Mw) of the styrenic polymer is 100,000 to 300,000, and the MFR is within a range of 1.5-5.0 g/10 min.SELECTED DRAWING: None

KANEHARA YASUTO

JP2023042345A

October 02, 2023

March 16, 2023

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PS JAPAN CORP

C08L57/04; C08F279/06; C08L25/14

Kenji Sugimura
Mitsutsugu Sugimura
Kengo Yoshida
Hiromitsu Takashi

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