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Title:
STYRENIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11302480
Kind Code:
A
Abstract:

To obtain a syndiotactic polystyrene based resin composition good in surface appearance of moldings, reduced in sink marks and, at the same time, improved in toughness with no addition of or a small amount of a rubber component.

Into 100 pts.wt. styrehic resin component comprising (A) 20-80 wt.% syndiotactic polystyrene; (B) 20-80 wt.% total amount of (B1) a polyamide 6 and (B2) a polyamide having a melting point of not lower than 250°C [(B1)/(B2)=2/8-8/2]; and (C) 0-10 wt.% rubber-like elastomer, 1-10 pts.wt. compatibilizer (D) having compatibility with component (A) and, at the same time a polar group reactive with components (B1) and (B2) is incorporated to obtain a desired styrenic resin composition. This composition may contain further 1-70 pts.wt. inorganic filler.


Inventors:
AOYAMA TAKUMA
OKADA AKIHIKO
Application Number:
JP11258798A
Publication Date:
November 02, 1999
Filing Date:
April 23, 1998
Export Citation:
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Assignee:
IDEMITSU PETROCHEMICAL CO
International Classes:
C08K3/00; C08L25/00; C08L77/00; (IPC1-7): C08L25/00; C08K3/00; C08L77/00
Attorney, Agent or Firm:
Tohei Masamichi