Title:
粒子ビーム加工装置によって処理可能な物質
Document Type and Number:
Japanese Patent JP4954060
Kind Code:
B2
Abstract:
The present invention is directed to methods for making materials treatable by electron beam (EB) processing, such as materials for flexible packaging, comprising: providing a substrate; applying an ink formulation on at least a portion of the substrate, the ink formulation comprising ink and at least one monomer selected from acrylates, vinyl ethers, cycloaliphatic diepoxides, and polyols; and applying a lacquer on at least a portion of the ink formulation, the lacquer comprising at least one monomer selected from acrylates, vinyl ethers, cycloaliphatic diepoxides, and polyols. The processing apparatus for EB treating the material operates at a low voltage, such as 110 kVolts or below.
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Inventors:
Imtia's Langwara
Application Number:
JP2007508512A
Publication Date:
June 13, 2012
Filing Date:
April 13, 2005
Export Citation:
Assignee:
ENERGY SCIENCES INCORPORATED
International Classes:
B32B27/16; B05D3/06; B05D7/02; B32B27/20; B41M7/00; C08F36/20; C08J7/04; C09D11/02
Domestic Patent References:
| JP2003535721A | ||||
| JP53067517A | ||||
| JP10067085A | ||||
| JP3060772A | ||||
| JP2004175449A |
Foreign References:
| WO2002051915A1 | ||||
| WO2003100814A1 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Kitahara Yasuhiro
Kitahara Yasuhiro