Title:
Substrate attachment component
Document Type and Number:
Japanese Patent JP5929006
Kind Code:
B2
Inventors:
Minoru Nakanishi
Teruaki Hatanaka
Working Hikari
Daisuke Kuroki
Kiyoshi Onozawa
Teruaki Hatanaka
Working Hikari
Daisuke Kuroki
Kiyoshi Onozawa
Application Number:
JP2011094619A
Publication Date:
June 01, 2016
Filing Date:
April 21, 2011
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65D85/86; B65G49/06; H01L21/673
Domestic Patent References:
| JP2008155995A | ||||
| JP2005178839A | ||||
| JP2006168749A | ||||
| JP2010120690A | ||||
| JP2008068902A |
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Yusuke Ito
Hideyuki Tateishi
Keiko Fukamachi
Hideo Ito
Naoki Goto
Yusuke Ito
Hideyuki Tateishi
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